Supporting Platform:Intel LGA 775/1366/1150/1151/1155/1156/2011/2011-v3,AMD SocketFM1/FM2/FM2+/AM2/AM2+/AM3/AM3+/AM4(Some platforms need to replace fixtures or crews).
It is suggested to use the special heat conducting liquid of Syscooling.
The base adopts the pure copper material with extremely high heat conducting efficient, and matched with green electroplating, which his anti-oxidation and resistant to corrosion.
Micro-cutting into dozens of fine water channels, which makes liquid contact more sufficient and bring heat away more quickly.
Imported PMMA material upper cover, which has extremely good transparency and strength.
The design of inlet/outlet is standard G1/4 thread with good compatibility, and could be used by matching the fast screwing or pagoda head.
High-quality sealing technique, it goes through 3 air-leakage tests before shipping, safe, leakage-proof and more reliable.