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C16
53*53*10.5mm(Length*Width*Height).
Full-metal design
high strength
good heat resistance
applicable to diversified environments
durable and reliable.
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Overall Dimensions:53*53*10.5mm(Length*Width*Height)


Supporting Platform:Intel LGA 775/1366/1150/1151/1155/1156/2011/2011-v3,AMD SocketFM1/FM2/FM2+/AM2/AM2+/AM3/AM3+/AM4(Some platforms need to replace fixtures or crews).


It is suggested to use the special heat conducting liquid of Syscooling.


Full-metal design, high strength, good heat resistance, applicable to diversified environments, durable and reliable. 


The base is made of high-purity red copper, which could bring heat more quickly. 


Square water channel design, which could effectively enhance the liquid contact area and enhance heat conducting efficiency.


The design of inlet/outlet is standard G1/4 thread with good compatibility, and could be used by matching the fast screwing or pagoda head. 


High-quality sealing technique, it goes through 3 air-leakage tests before shipping, safe, leakage-proof and more reliable.