Supporting Platform:Intel LGA 775/1366/1150/1151/1155/1156/2011/2011-v3,AMD SocketFM1/FM2/FM2+/AM2/AM2+/AM3/AM3+/AM4(Some platforms need to replace fixtures or crews).
It is suggested to use the special heat conducting liquid of Syscooling.
Full-metal design, high strength, good heat resistance, applicable to diversified environments, durable and reliable.
The base is made of high-purity red copper, which could bring heat more quickly.
Square water channel design, which could effectively enhance the liquid contact area and enhance heat conducting efficiency.
The design of inlet/outlet is standard G1/4 thread with good compatibility, and could be used by matching the fast screwing or pagoda head.
High-quality sealing technique, it goes through 3 air-leakage tests before shipping, safe, leakage-proof and more reliable.