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SysCooling water cooling
Design case analysis
Heat Dissipation of Semiconductor

  Customer Demands:

  The customer engaged in the semiconductor cooling industry, the feature of semiconductor is refrigerating on one side and heating on the other side, due to the currently poor effect of air-cooled heat dissipation, the temperature on the heating side was too high, which severely affected the refrigerating effect on the cooling side, and the noise was too high due to the excessively high rotary speed of fans. Therefore, the customer commissioned the R&D Department of Dongyuan Syscooling, and hoped to have effective water-cooling and heat dissipation on the heating side, control the temperature of the heating side to relatively low level, so as to enhance the refrigerating efficiency of the refrigerating side, and reduce the noise of the entire system.


  Demand analysis:

  The heating core had area of 40*40mm, thickness of 4mm, output voltage of DC12V, rated current of 10A, rated power of 120W, and refrigerating capacity of 72W, which could be equivalent to the heat source of 192W.


  Design Objective:

  In the current air-cooled heat dissipation method of the customer, under room temperature of 20, the heating side was at 51, the refrigerating side was at -4; as analyzed, the R&D Department planned to control the temperature of the heating side at the room temperature of 20 to the level below 40, and control the temperature of the refrigerating side to the level below -10, and reduce the noise level at 1M to the level below 30dB.


  Solution:

  *The overall system adopted the solution of 300T water pump → customized water cooling head → 120 aluminum radiator/1,500RPM fans;

  *The 300T water pump had small size, silence and high stability, so it met the customer's demand;

  *Through 6 times of thermal physics simulation and calculation, it was finally determined that the design of such water cooling head was the overall size of 70*40*6mm, the internal water route was designed into 1mm thick and 1mm interval, the water inlet and outlet adopted the G1/4 screw thread, and the material adopted the pure copper with relatively high heat conductivity coefficient;

  *The customer product had relatively light quality, so the light aluminum radiators were adopted;

  *The scheme had thermal physics CFD treatment, at the room temperature of 20, the highest temperature on the heating side was controlled at 33, which met the expectation.


  Product/Solution Delivery:

  Based on the solution of the R&D Design Department of Dongyuan Syscooling, the customer successfully controlled the temperature of the heating side at the 20 room temperature to the level of 36, and controlled the temperature of the refrigerating side to the level of -14, reduced the noise level at 1M to the level of 28dB, as well as maintained the good-looking appearance of the products designed by the customer.



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